Date Posted: December 12, 2024

Deadline: May 12, 2025

Organization: Airsys

Location: Other

City: Anderson

Website: View Website

Job Type: Full Time

Requirements:

Qualifications:

  • Bachelor’s degree in Aerospace, Thermal, or Mechanical Engineering; a Master’s degree is a plus.
  • Experience with server/PC products focusing on mechanical or thermal functions is preferred.
  • Proficient knowledge in thermal management hardware, heat transfer materials, heat exchangers, pumps, and cooling devices at a rack/cluster level.
  • Strong skills in mechanical/thermal engineering analysis, validation, documentation, and communication.
  • Familiarity with both mechanical/thermal and electrical/power aspects, including power distribution, AC power types, power calculations, DC power, and regulatory/safety considerations, is a plus.
  • Experience with server/rack liquid cooling solutions, including DCL (direct chip liquid cooling), rear door liquid cooling, liquid immersion cooling, and chilled water piping, is advantageous.
  • Must demonstrate a strong work ethic, the ability to thrive in a team environment, and adapt to a fast-paced setting.
  • Excellent organizational and problem-solving skills.
  • Effective communication skills, both verbal and written.
  • Willingness to travel for on-site customer deployments.

Job Type: Full-time

Work Location: Anderson, SC

Job Description:

Job Summary:

We are seeking a passionate Thermal Application/Project Engineer to lead the cluster-level architecture, design, analysis, and validation of liquid cooling technologies for HPC customer needs. This role emphasizes a design process based on estimating, simulating, and testing the thermal performance of new products and architectures. The ideal candidate will possess a strong background in heat transfer, fluid dynamics, and implementing thermal solutions in enterprise electronics.

 

Responsibilities:

  • Develop and validate thermal/liquid cooling solutions for HPC cluster platforms in accordance with industry standards and customer specifications.
  • Evaluate system layout, power consumption, TCO, PID, BOM, acoustics, sensors, and related mechanical testing.
  • Perform cluster-level thermal analysis, definition, and testing, including chamber test setup, thermocouple installation, and automated data acquisition.
  • Conduct thermal debugging, system optimization, and documentation.
  • Oversee the development, design, documentation, and deployment of cluster-level liquid cooling customer projects.
  • Handle additional responsibilities such as rack integration, documentation, facilities preparation, on-site service, and support for PM/Sales/Field Application Engineers on customer projects.
  • Collaborate with cross-functional product development teams and international partners to meet reliability, power efficiency, system performance, and cost requirements.
Schedule:
Monday - Friday
Contact Name:
Kayla Sai
Contact Phone Number: 8645645594
Application Process:
Apply online
Employer Address:

7820 Reidville Road
100
Greer, SC 29651
United States

Our organization does not discriminate on the basis of race, color, religion, national origin, age, sex, sexual orientation, or disability.